Imprint method using a mold and process for producing structure using an imprint apparatus

ABSTRACT

In order to alleviate or suppress curing of a photocurable resin material in an area in which the curing of the photocurable resin material is not intended, exposure of the photocurable resin material to light is suppressed through a non-pattern portion at which a light-blocking member is provided by means of a mold having an imprint pattern portion and the non-pattern portion or is suppressed by disposing a light-blocking member so as not to irradiate the photocurable resin material with light not via the mold.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of application Ser. No. 11/468,870, filedAug. 31, 2006, which claims priority from Japanese Patent ApplicationNo. 257431/2005, filed Sep. 6, 2005. Both prior applications are herebyincorporated herein by reference.

FIELD OF THE INVENTION AND RELATED ART

The present invention relates to a mold having a shape that is to betransferred onto a work or workpiece (member to be processed). Thepresent invention also relates to an imprint apparatus and a process forproducing a structure.

In recent years, as described in Stephan Y. Chou et al., Appl. Phys.Lett., Vol. 67, Issue 21, pp. 3114-3116 (1995), fine processingtechnology for transferring a minute structure on a mold onto a workcomprising a semiconductor, glass, resin, metal, etc., has beendeveloped and has received attention.

Because this technology provides a resolution on the order of severalnanometers, it is called nanoimprint (nanoimprinting) or nanoembossing.Although the nanoimprint has the above-described resolution, it is alsosuitably used for processing members having minimum processing widths ofnot more than 1 mm, not more than 1 μm, and not more than 100 nm.Further, according to the nanoimprint, it is possible to simultaneouslyprocess an area having a processing width of not more than 100 nm and anarea having a processing width of not more than 1 μm with respect to awork. In other words, the nanoimprint has such an advantage, comparedwith a processing of a work by photolithography, that processing of thework can be performed in a plurality of areas having processing widthsthat differ by not less than one digit, more preferably not less thanthree digits, at the same time.

This technology can be employed not only in the production of asemiconductor device, but also in batch processing of athree-dimensional structure at a wafer level. For this reason, thenanoimprint has been expected to be applied to a wide variety of fields,e.g., production technologies for an optical device, such as a photoniccrystal, a micro total analysis system (μ-TAS), a biochip, etc.

The case where a semiconductor device as a structure is produced througha photoimprint method will be described.

First, a layer of photocurable resin material is formed on a substrate(e.g., a semiconductor wafer).

Next, a mold (or template) on which a desired imprint structure isformed is brought into contact with the resin layer. In this state, theresin layer is irradiated with ultraviolet light to cure thephotocurable resin material.

As a result, an imprint pattern of the above-described imprint structureon the resin layer is inverted. This is referred to as a transfer of animprint structure.

Further, by using the resin layer as an etching mask, e.g., etching ofthe substrate surface is effected to transfer the imprint structure ontothe substrate.

As described above, different from a conventional processing methodusing a light exposure apparatus, the imprint (method) permits transferof the minute structure provided on the mold onto the work.

During the processing by the imprint, the photocurable resin materialflowing from the mold is adhered to the mold on its lateral side. Thephotocurable resin material adhered to the lateral side of the mold iscured, together with the photocurable resin material located at aportion at which the imprint structure (imprint pattern) is to beformed, by light passing through the outside of the mold during lightexposure. By such curing, a large force acts on the mold or the workduring a release of the mold from the work to damage the mold or thework.

Further, in some cases, the photocurable resin material outside theportion at which the imprint pattern is to be formed is excessivelyexposed to light passing through the outside of the imprint patternportion formed in the mold during light exposure and deforms into anundesirable shape. Particularly, in such a case where a resin materialis applied onto a substrate by spin coating and processing of a work isrepeated by a step-and-repeat method, the portion at which the imprintpattern is to be formed is exposed to light before the processing.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a mold capable ofalleviating or suppressing curing of a photocurable resin material in anarea in which the curing of the photocurable resin material is notintended.

Another object of the present invention is to provide a pressureprocessing apparatus using the mold and a production process of astructure using the pressure processing apparatus.

According to an aspect of the present invention, there is provided amold for use in an imprint apparatus in which a photocurable member tobe processed is processed by irradiation, through a mold having animprint pattern, with light for curing the member to be processed in astate in which the mold is brought into contact with the member to beprocessed, the mold comprising:

a processing side having an imprint pattern;

a back side opposite from the processing side; and

a non-pattern portion at which the imprint pattern is not provided;

wherein the mold further comprises a light-blocking member, disposed atthe non-pattern portion, for decreasing an amount of light with whichthe member to be processed is irradiated through the non-patternportion.

According to another aspect of the present invention, there is providedan imprint apparatus for processing a photocurable member byirradiation, through a mold having an imprint pattern, with light forcuring the member to be processed in a state in which the mold isbrought into contact with the member to be processed, the apparatuscomprising:

a mold comprising a processing side having an imprint pattern, a backside opposite from the processing side, and a non-pattern portion atwhich the imprint pattern is not provided; and

an exposure light source;

wherein the mold further comprises a light-blocking member disposed atthe non-pattern portion so as to decrease an amount of light with whichthe member to be processed is irradiated through the non-patternportion.

According to another aspect of the present invention, there is providedan imprint apparatus for processing a photocurable member to beprocessed by irradiation, through a mold having an imprint pattern, withlight for curing the member to be processed in a state in which the moldis brought into contact with the member to be processed, the apparatuscomprising:

a light source for generating the light; and

a mold holding portion for holding the mold;

wherein the apparatus further comprises a light-blocking member fordecreasing an amount of light with which the member to be processed isirradiated from the light source not through the mold.

According to another aspect of the present invention, there is provideda process for producing a structure, comprising:

applying a photocurable resin material as a member to be processed ontoa substrate; and

forming a resin layer having an imprint pattern by curing thephotocurable resin material with the imprint apparatus described above.

According to a further aspect of the present invention, there isprovided a process for producing a structure, comprising:

applying a photocurable resin material as a member to be processed ontoa substrate;

forming a resin layer having an imprint pattern by curing thephotocurable resin material with the imprint apparatus described above;

etching the substrate by using the resin layer having the imprintpattern as a mask; and

removing the resin layer remaining on the substrate after the etching.

According to a still further aspect of the present invention, there isprovided a process for producing a structure, comprising:

preparing the imprint apparatus described above; and

curing a specific portion of photocurable resin material located in aprocessing area to effect transfer of a pattern formed on a processingside of a mold.

Using the above-described light-blocking member, according to thepresent invention, it is possible to alleviate or suppress the curing ofthe photocurable resin material in an area other than a portion at whichthe imprint pattern is to be formed by processing.

These and other objects, features and advantages of the presentinvention will become more apparent upon a consideration of thefollowing description of the preferred embodiments of the presentinvention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1H are schematic views each showing a constitution of a moldaccording to an embodiment of the present invention.

FIGS. 2A and 2B are schematic views each showing a preparation method ofa mold provided with a light-blocking member.

FIGS. 3A and 3B are schematic views each showing an example of aconstitution of an imprint apparatus according to an embodiment of thepresent invention.

FIG. 4A is a top view for illustrating a procedure for processing a workin an embodiment of the present invention, and FIG. 4B is a sectionalview taken along the A-A′ line shown in FIG. 4A.

FIG. 5A is a top view showing a work after processing in an embodimentof the present invention, and FIG. 5B is a sectional view taken alongthe A-A′ line shown in FIG. 5A.

FIGS. 6A to 6D are schematic views for illustrating an occurrence ofdeficiency in the case where a light-blocking member is not provided.

FIGS. 7A to 7D are schematic views each showing a constitution of aprojection-type mold according to another embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In an embodiment of the present invention, a mold having an imprintpattern can be constituted in the following manner.

FIG. 1A shows a cross-section of the mold in this embodiment.

Referring to FIG. 1A, the mold includes a transparent member 101, aprocessing side 102, a light-blocking member 103, an imprint patternportion 104, and a non-pattern portion 105. Incidentally, broken linesbetween the imprint pattern portion 104 and the non-pattern portion 105in the figure are depicted for indicating a boundary therebetween forconvenience of an explanation.

The mold has a first surface 106 and a second surface 107. The firstsurface 106 constitutes the processing side 102 having an imprintpattern and the second surface 107 constitutes a side identical inlocation to the processing side 102 having the imprint pattern at theimprint pattern portion 104.

As shown in FIG. 1A, in the case of providing the non-pattern portion105 so as to be adjacent to the imprint pattern portion 104, thelight-blocking member 103 is provided at least at any one of the side107 identical in location to the processing side 106 having the imprintpattern at the non-pattern portion 105, a side identical in location toback side at the non-pattern portion 105, and a lateral side of the moldat the non-pattern portion.

In the case where the non-pattern portion 105 is not provided to themold, as described below, the light-blocking member may be disposed atthe lateral side of the mold. In this case, the mold itself can beregarded as the non-pattern portion.

The light-blocking member used in the present invention may include notonly the one, which completely blocks light capable of curing aphotocurable resin material constituting at least a part of a work, butalso the one, which does not completely block the light. In the lattercase, the light-blocking member may only be required to provide anecessary difference in the degree of curing of the photocurable resinmaterial between an area in which the light is not blocked and an areain which the light is blocked.

In another embodiment of the present invention, as described later, itis preferable that an imprint apparatus includes a light-blocking member(light-blocking means) for blocking light with which a member to beprocessed is irradiated from an exposure light source not through themold.

According to this embodiment of the present invention, it is possible toalleviate or suppress the curing of the photocurable resin material inthe neighborhood of the lateral side of the mold. Further, the mold maybe constituted by providing the light-blocking member so that thephotocurable resin material close to the lateral side of the mold duringprocessing is not cured or is less cured than that located in theimprint pattern portion.

In the case where the processing is performed by a step-and-repeatmethod, only a photocurable resin material (uncured resin material) in aspecific processing area of a work (member to be processed) is exposed,so that an uncured resin material in an area to be subsequentlyprocessed is prevented from being exposed to light.

The step-and-process method may, e.g., be the following method.

First, a work is prepared by coating an entire surface of a substratewith a photocurable resin material. Next, a part of the surface of thework is irradiated with light in a state in which the mold is broughtinto contact with the work, whereby the photocurable resin material onlyat the part of the surface of the substrate is cured. Thereafter, themold is removed from the work. These steps are repetitively performedwith respect to another part of the surface of the substrate whilemoving the work in an in-plane direction of the work.

Herein, the photocurable resin material after being cured by lightirradiation is no longer the photocurable resin material, but isinclusively referred to, sometimes, as the photocurable resin materialfor convenience.

Another embodiment of the present invention will be described below. Asdescribed above, the object of the present invention is to suppress oralleviate the curing of the photocurable resin material in an area inwhich the curing of the photocurable resin material is not intended.Thus, the present invention is not limited to the following embodiment.

Here, the area in which the curing of the photocurable resin material isnot intended means, e.g., the following areas in the case where a moldhas an imprint pattern portion and a non-pattern portion adjacent to theimprint pattern portion. More specifically, examples of such areas mayinclude an area of the photocurable resin material at the non-patternportion, an area of the photocurable resin material in the neighborhoodof an outer periphery portion (lateral side) of the mold, and an area ofthe photocurable resin material located at an outer lateral side of themold during contact with the photocurable resin material.

Embodiments of the Mold

With reference to FIGS. 1B to 1H, constitutions of molds according toseveral embodiments of the present invention will be described.

In these figures, the same members or portions identical to those inFIG. 1A are represented by identical reference numerals.

FIG. 1B shows a constitution in which the light-blocking member 103 isdisposed only at a lower portion of the lateral side of the mold.

FIG. 1C shows a constitution in which the light-blocking memberprotrudes downward from the lateral side of the mold.

In the above-described constitution, a light-blocking effect is furtherenhanced in the case of FIG. 1A, i.e., in the case where a level of thelateral side of the mold does not reach the same level as a (lower)surface of the projection constituting the imprint pattern at theimprint pattern portion 104. Further, in the case of FIG. 1C, a lengthof the protruded portion of the light-blocking member from the lateralside of the mold may desirably be not more than a distance between thesurface of the projection of the imprint pattern portion 104 and thesurface 107 identical in location to the processing side of the mold atthe non-pattern portion 105.

FIG. 1D shows a constitution in which a reinforcing member 108 forreinforcing the light-blocking member 103 is provided. For example, insome cases, the light-blocking member 103 has a thickness ofapproximately 50 nm. In this case, when the light-blocking member doesnot have a sufficient strength, it is possible to prevent a breakage atthe lower portion of the light-blocking member 103 by reinforcing thelower portion with the reinforcing member 108.

FIG. 1E shows a constitution in which the light-blocking member 103 isdisposed at a lower side (surface) 107. In this case, the light-blockingmember 103 may desirably have a thickness of not more than the distancebetween the surface of the projection of the imprint pattern portion 104and the surface 107 identical in location to the processing side of themold.

FIG. 1F shows a constitution in which the light-blocking member 103 isdisposed on a back side (upper side) at the non-pattern portion 105.

FIG. 1G shows a constitution in which the light-blocking member 103 isdisposed at the lower side (surface) 107 in addition to the lateral sideof the mold. In this case, at the lower side 107, the light-blockingmember 103 may desirably have a thickness of not more than the distancebetween the surface of the projection of the imprint pattern portion 104and the surface 107 identical in location to the processing side of themold.

FIG. 1H shows a constitution in which the light-blocking member 103 isdisposed on the back side (upper side) at the non-pattern portion 105 inaddition to the lateral side of the mold.

Further, another embodiment of the present invention will be describedwith reference to FIGS. 7A to 7D.

Different from the molds shown in FIGS. 1A to 1H, those shown in FIGS.7A to 7D are of such a projection type wherein a third side is providedbetween the processing side and the back side.

Referring to FIG. 7A, the mold includes a transparent member 701, alight-blocking member 702, a third side 703, a second side 704, a thirdside 705, and a back side 706. In FIG. 7B, the light-blocking member 702is disposed on the lateral side located between the first side 703 andthe third side 705 and is disposed on the third side 705. In FIG. 7C,the light-blocking member 702 is disposed on the third side 705. In FIG.7D, the light-blocking member 702 is disposed on the lateral sidelocated between the first side 703 and the third side 705, on the thirdside 705, and on the lateral side located between the third side 705 andthe back side 706.

Next, a preparation method of the above-described mold will be describedwith reference to FIGS. 2A and 2B, each showing steps for providing alight-blocking member 203 on a lateral side of a substrate 201 formed ofa transparent member for a mold. On the substrate 201, a resist 202 isto be disposed.

Herein, the mold substrate 201 has a front side as a processing side tobe subjected to processing, a back side opposite from the front side(processing side), and a lateral side connecting the front side and theback side.

First, the preparation method of the mold by vapor deposition will bedescribed with reference to FIG. 2A showing steps a-1 to a-5.

In step a-1, the substrate 201 is prepared. The substrate 201 may beformed of a light-transmissive substance including heat-resistant glass,such as quartz glass or Pyrex (registered trademark), and sapphire.

Next, in step a-2, a negative resist 202 is applied onto the processingside of the substrate 201 by a spin coater or the like and is irradiatedwith light to be modified so that it is not readily dissolved in adeveloping solution.

Next, in step a-3, a negative resist 202 is applied onto the back sideof the substrate 201 by a spin coater or the like and is irradiated withlight to be modified so that it is not readily dissolved in a developingsolution.

When the resist is adhered to the lateral side of the substrate, it canbe removed by, e.g., polishing. Further, in steps a-2 and a-3, thecoating may also be performed after a film-like mask is provided on thelateral side of the substrate so that the resist is not adhered to thelateral side of the substrate.

Next, in step a-4, a light-blocking member 203 is provided on thelateral side of the substrate. The light-blocking member 203 isvapor-deposited in a layer (film) of a metal, such as Cr, on the lateralside of the substrate by sputtering, chemical vapor deposition (CVD),vacuum vapor deposition, ion plating, etc. The resultant metal film isonly required to sufficiently block ultraviolet (UV) light and maydesirably have a thickness of not more than 50 nm. Further, thelight-blocking member 203 may be formed of organic materials of anacrylic type, a urethane type, a polycarbonate type, etc., or ofinorganic materials of a carbon type, etc. These materials may furthercontain other materials, such as a colorant.

Next in step a-5, the resist 202 is removed from the substrate 201 tocomplete the substrate 201 with the light-blocking member 203.

Then, the surface of the substrate 201 is processed by a methoddescribed below to form an imprint pattern (not shown).

Next, the preparation method of the mold by polishing will be describedwith reference to FIG. 2B showing steps b-1 to b-4.

First, in step b-1, a substrate 201 is prepared.

Next, in step b-2, a light-blocking member 203 is disposed on thesubstrate 201 by dipping the substrate 201 in or coating the substrate201 with a solution containing a material constituting thelight-blocking member 203 or its precursor. Then, the light-blockingmember 203 is fixed on the substrate 201 by removing the solvent. In thecase where the light-blocking member 203 is provided only at a part oflateral side of the substrate 201, dipping of the substrate 201 may beeffected to a necessary depth.

The light-blocking member 203 may be formed of the same material asthose described with reference to FIG. 2A.

Next, in step b-3, the light-blocking member 203 formed on a back sideof the substrate 201 is removed by polishing the back side of thesubstrate 201 through chemical mechanical polishing (CMP), etc.

Next, in step b-4, a front side of the substrate 201 is polished tocomplete the substrate 201 provided with the light-blocking member 203on the lateral side of the substrate 201.

Incidentally, the light-blocking member 203 is not limited to thoseformed by the above-described liquid phase deposition or vapor phasedeposition, but may also be formed by adhering a film-likelight-blocking substance or a plate-like light-blocking substance to thesubstrate 201.

Further, it is also possible to provide a mask in advance at a positionwhere the light-blocking member 203 is not intended to be formed.

Further, the steps b-2 and b-3 may also be repeated in several cycles.

It is also possible to use the methods shown in FIG. 2A and FIG. 2B incombination.

The processing side of the thus prepared substrate having thelight-blocking member is subjected to formation of the imprint patternthrough an ordinary patterning method, such as photolithography,electron beam lithography, focused ion beam (FIB) processing, or X-raylithography, thus completing the mold.

Incidentally, the light-blocking member may also be formed after theimprint pattern is formed on the processing side of the substrate.

Effect of the Imprint Apparatus

A constitutional example of an imprint apparatus according to anembodiment of the present invention will be described.

FIG. 3A shows the constitutional example of the imprint apparatus inthis embodiment.

Referring to FIG. 3A, the imprint apparatus may include a mold 301, amold holding portion 302, a body tube 303, a photocurable resin material304, a substrate 305, a work holding portion 306, a work pressingmechanism 307, an XY moving mechanism 308, an exposure light source 309,a light-blocking member 310, exposure light 310, and an imprint controlmechanism 312.

The imprint apparatus in this embodiment is principally constituted bythe mold holding portion 302, the work holding portion 306, the workpressing mechanism 307, the XY moving mechanism 308, the exposure lightsource 309, and the imprint control mechanism 312. On the work holdingportion 306, a work (member to be processed) constituted by thesubstrate 305 coated with the photocurable resin material 304 by acoating method, such as spin coating or slit coating, is disposed. Theimprint apparatus further includes a position detection apparatus foreffecting the alignment, which is not shown and is omitted from theexplanation.

The mold holding portion 302 effects chucking of the mold 301 by avacuum chucking method or the like. The work is movable to a desiredposition by the XY moving mechanism 308, and the work pressing mechanism307 can effect a height adjustment (level control) and pressing of thework. The exposure light 311 from the exposure light source 309 passesthrough the body tube 303 and reaches the mold 301. The light 311 isrestricted so as not to reach the outside of the mold 301 by limitinglight fluxes with a lens or a diaphragm. The position movement,pressing, and light exposure of the work are controlled by the imprintcontrol mechanism 312.

The mold 301 shown in FIG. 3A in this embodiment is constituted by atransparent member and is provided with a light-blocking member 103 onan entire lateral side (non-pattern portion) of the mold 301. As aresult, it is possible to prevent the light 311 from reaching theoutside of the mold 301 through the mold 301, so that it is possible toprevent the photocurable resin material 304 from being cured at aportion outside the mold 301 and being excessively exposed to light atthe portion outside the mold 301. Particularly, an in-plane area of thework, which has not been subjected to processing, cannot be exposed tolight, so that it is possible to prevent a phenomenon in which thephotocurable resin material 304 in the in-plane area (before processing)is cured so as not to permit a transfer of the imprint pattern of themold 301.

FIG. 3B shows another example of the body tube 303, which is constitutedin the following manner.

As shown in FIG. 3B, the light-blocking member 310 is provided atnecessary portions of the body tube 303 and the mold holding portion302, so that the exposure light reaching a portion other than anecessary portion for exposure not through the mold, i.e., the so-calledstray light is completely blocked. By employing such a constitution, itis possible to prepare the body tube 303 and the mold holding portion302 with a light-transmissive material. Further, it is not necessary tolimit an irradiation range of the light from the light source 309 by thelens or diaphragm.

The exposure light emitted from the light source 309 passes through themold to reach the back side of the mold. Even when light fluxes of theexposure light from the light source travel in a divergent manner, inparallel lines, or in a convergent manner, they are reflected orscattered by various members in some cases depending on a constitutionof the imprint apparatus. Further, there is also a possibility that theexposure light leaks from a gap between the members.

In these cases, by adopting the constitution as shown in FIG. 3B, it ispossible to further enhance the light-blocking effect. Morespecifically, the light-blocking member 310 is provided at necessaryportions of the body tube 303 and the mold holding portion 302, i.e., onthe lateral side of the body tube 303 and the lateral side and theperipheral lower side of the mold holding portion 302, thus completelyblocking the exposure light from reaching portions other than thenecessary portions. By using the light-blocking member 310 and thelight-blocking member 103 for the mold 301 in combination, an area to beexposed to light of the work is restricted to an area identical to thelower side (processing side) of the mold at the imprint pattern portion.

Embodiment of the Production Process of the Structure

A process for producing a structure according to an embodiment of thepresent invention will be described.

FIGS. 4A and 4B are schematic views for illustrating a procedure forprocessing a work, wherein FIG. 4A is a top view and FIG. 4B is asectional view taken along the A-A′ line shown in FIG. 4A.

Referring to FIGS. 4A and 4B, reference numeral 401 represents a work,407 represents a mold, 408 represents a substrate, 409 represents aphotocurable resin material, and 410 represent a cured resin materialafter an imprint pattern is transferred onto it. On an entire lateralside of the mold 407, a light-blocking member 103 is provided. Further,reference numeral 405 represents a processing path, which is theshortest path for processing. In the work 401, numbers 1 to 21 eachrepresents an area per one shot of processing and the processing of workis performed on the order of an increasing number. Further, referencenumeral 402 indicated by a broken line shows nine areas, No. 1 to No. 9,which have already been processed. Reference numeral 403 indicated by abold solid line shows a current processing area No. 10. Referencenumeral 404 indicated by a solid line shows even unprocessed areas, No.11 to No. 21. Further, reference numeral 406 represents an unexposedarea, in the neighborhood of an edge of the wafer (work), which is notexposed to light even after the processing of the work is completed.

The processing of the work is effected by repetitively performing the XYmovement of the work, contacting the mold with the work, exposing thework to light, and removing the mold.

For example, the processing of the work at position No. 10 will bedescribed.

First, the work moved to position No. 10 is brought into contact withthe mold or the mold is brought into contact with the work. As a result,the photocurable resin material that cannot be accommodated between themold and the work flows from the processing side to the outside of theprocessing side.

Then, only the photocurable resin material within the processing areaNo. 10 is cured by light exposure. In this case, by using theabove-described light-blocking members, it is possible to block thelight passing through the processing side of the mold and thenon-pattern portion of the mold during light irradiation from the lightsource. For this reason, the photocurable resin material flowing fromthe processing side to the outside of the processing side is not exposedto light and is, thus, not cured. As a result, it is possible to preventthe mold and the work from being damaged during the removal of the moldfrom the water. Further, it is possible to block the light that travelstoward the outside of the processing area No. 10, so that areas Nos. 1to 9 are not excessively exposed to light, and light exposure inunprocessed areas Nos. 11 to 21 can be prevented.

Further, it is possible to decrease a processing margin in theprocessing area. Accordingly, it is also possible to set a distance ofmovement of the mold during the processing so as to be equal to thelength of one side of the mold. As a result, it is possible toeffectively use a planar area of the substrate.

In the case where the resin material itself, which has been cured andformed in an imprint pattern, is used as a structure, the productionprocess of the structure is completed. Further, in the case where theproduction process of the structure is used in production of asemiconductor device such as LSI, by using the resin material itself,which has been cured and formed in the imprint pattern, as an etchingmask, the surface of the underlying substrate is subjected to etching soas to form a recess, such as grooves corresponding to theabove-described imprint pattern.

FIGS. 5A and 5B show the work after the processing is completed. FIG. 5Ais a top view of the work and FIG. 5B is a sectional view of the worktaken along the A-A′ line shown in FIG. 5A.

In these figures, reference numeral 501 represents a work, 502represents an area after the processing, 503 represents an unexposedarea, 504 represents a substrate, 505 represents a cured resin materialafter a pattern is transferred onto the cured resin material, and 506represents an uncured resin material, which flows from the processingarea to the outside of the processing area during the processing and islocated in the neighborhood of the boundary of the processing areawithout being exposed to light.

The uncured resin materials in the neighborhood of the boundary of theprocessing area and in the unexposed area adversely affect subsequentsteps in some cases. For example, the pattern portion is covered withthe uncured resin material, and when the etching is performed in such astate, an etching rate is changed and a desired pattern is not obtained.In order to obviate such an adverse affect, the uncured resin materialscan be blown off, removed by washing, or cured by exposure to light.

Incidentally, as the coating method of the photocurable resin material,it is possible to use an ink jet method in which the photocurable resinmaterial is coated on the substrate for each processing area. In thecase where the processing is effected by using the ink jet method, acycle of application of the resin material onto a processing area, XYmovement of the work, contact of the mold with the work, light exposureto the work, and removal of the mold from the work is repeated. In thiscase, on the substrate, there are three areas including an area in whichthe processing is effected so as to transfer the pattern onto the resinmaterial, an area in which the processing has not yet been effected andthe substrate provided with no resin material is exposed, and an areabeing processed. Even in such a case, by using the light-blockingmembers in this embodiment, it is possible to prevent irradiation of thearea, after the processing is completed, with the exposure light. As aresult, the resin material in the processed area can be prevented frombeing excessively exposed to light.

Here, in the case where the light-blocking member is not provided to themold or the imprint apparatus, an occurrence of a defect will bedescribed more specifically.

A constitutional example in the case where the light-blocking member isnot provided to the mold or the imprint apparatus is shown in each ofFIGS. 6A to 6D.

In these figures, reference numeral 601 represents a mold, 602represents exposure light, 603 represents a substrate, 604 represents aresin material, 605 represents a resin material flowing from the mold601 to the outside of the mold 601, 606 represents a processing area inwhich the mold 601 has been successfully removed from the substrate 603.The processing area 606 includes a mold area 607 and margin area 608.The margin area 608 is a minimum area, located outside the mold 601, inwhich the resin material is cured by exposure to light.

FIG. 6A shows a light exposure process. The exposure light is radiallydiverged from the light source and passes through the inside of themold, so that the outside of the mold is irradiated with the exposurelight. As a result, the resin material is exposed to light in not onlythe mold area, but also in the margin area.

The defect in such a constitution will be described below.

The pattern has a depth (thickness) on the order of approximately 100nm, but the thickness of the resin material flowing outside the moldsometimes amounts to several millimeters. When such a resin material iscured, it is possible for a part or all of the resin material on thesubstrate to be removed due to the thin layer of resin material on thesubstrate. Further, when the amount of the exposure light is small and,thus, the resin material is not sufficiently cured, the resin materialis attached to the mold and can be dropped from the mold during themovement of the mold to result in a defect.

A specific example the defect will be described with reference to FIGS.6B to 6D.

FIG. 6B shows an example in which a small resin material piece 609 isseparated from a resin material 610 and attached to the mold. Such aresin material piece 609 is sometimes dropped from the mold onto thework during the processing. When the dropped resin material piece 609 issandwiched between the work and the mold and deposited on the processingside of the mold, from then on, the processing apparatus has a defect.

FIG. 6C shows an example in which a large resin material piece 611 isremoved from the substrate 603, so that a surface 612 of the substrate603 is exposed. In this case, the resin material piece 611 is cured anda defect occurs in subsequent areas.

FIG. 6D shows an example in which a resin material portion 613 ispartially raised from the substrate 603 in an area. When this area is amargin area, the resin material portion 613 is a limitative defect.

In the cases shown in FIGS. 6B to 6D, according to the embodiments ofthe present invention, it is possible to prevent the curing of the resinmaterial located at a peripheral portion of the processing area of themold, thus preventing an occurrence of a defect, etc.

While the invention has been described with reference to the structuresdisclosed herein, it is not confined to the details set forth above, andthis application is intended to cover such modifications or changes asmay come within the purpose of the improvements or the scope of thefollowing claims.

1. An imprint method, comprising: providing a substrate having a first aphotocurable resin material and a mold having an imprint pattern so asto be opposed to each other; changing, in a first processing area on thesubstrate, a shape of the first photocurable resin material into a shapesuch that the imprint pattern of the mold is inverted; curing the firstphotocurable resin material in the first processing area by exposure toexposure light; separating the cured first photocurable resin materialand the mold; providing, in a second processing area on the substratewhich does not overlap with the first processing area, a secondphotocurable resin material on the substrate and the mold so as to beopposed to each other; changing a shape of the second photocurable resinmaterial into the shape such that the imprint pattern of the mold isinverted; curing the second photocurable resin material in the secondprocessing area by the exposure to exposure light while light-blocking aside surface of the mold with a light-blocking member provided on themold so that the cured first photocurable resin material in the firstprocessing area is prevented from being exposed again to the exposurelight which passes through an inside of the mold and leaks out from theside surface of the mold; and separating the cured second photocurableresin material and the mold.
 2. The method according to claim 1, whereinwhen the first photocurable resin material in the first processing areais changed in shape into the shape such that the imprint pattern of themold is inverted, and then is cured, the first photocurable resinmaterial in the first processing area is cured by the exposure to theexposure light while preventing the first photocurable resin material,flowing to an outside of the first processing area, from being cured. 3.The method according to claim 1, wherein while preventing the secondprocessing area from being exposed to the exposure light, the firstphotocurable resin material in the first processing area is changed inshape into the shape such that the imprint pattern of the mold isinverted, and then is cured.
 4. The method according to claim 1, whereinthe first and second photocurable resin materials are applied onto thesubstrate in the first and second processing areas, respectively.
 5. Themethod according to claim 1, wherein the first and second photocurableresin materials are collectively applied onto a surface of the substrateincluding the first and second processing areas.
 6. The method accordingto claim 1, wherein the mold has three surfaces including a processingsurface on which the imprint pattern is formed, a back surface oppositefrom the processing surface, and a surface which is provided between theprocessing surface and the back surface and in an area other than anarea in which the processing surface is formed, and wherein the threesurfaces provide a projection structure.
 7. The method according toclaim 1, wherein the imprint method is repeated to provide, on thesubstrate, a plurality of transfer areas onto which the imprint patternof the mold is transferred, and then an uncured resin material which isdispersed and remains at a plurality of portions each between adjacenttransfer areas of the plurality of transfer areas is removed.
 8. Aprocess for producing a structure, the process comprising: applying aphotocurable resin material as a member to be processed onto asubstrate; and forming a resin layer having an imprint pattern by curingthe photocurable resin material using light with an imprint apparatuscomprising: a mold comprising a processing side having an imprintpattern, a back side opposite from the processing side, and anon-pattern portion at which the imprint pattern is not provided; and anexposure light source, wherein the mold further comprises alight-blocking member disposed at the non-pattern portion so as todecrease an amount of light with which the member to be processed isirradiated through the non-pattern portion.
 9. A process for producing astructure, the process comprising: applying a photocurable resinmaterial as a member to be processed onto a substrate; forming a resinlayer having an imprint pattern by curing the photocurable resinmaterial using light with an imprint apparatus comprising: a moldcomprising a processing side having an imprint pattern, a back sideopposite from the processing side, and a non-pattern portion at whichthe imprint pattern is not provided; and an exposure light source,wherein the mold further comprises a light-blocking member disposed atthe non-pattern portion so as to decrease an amount of light with whichthe member to be processed is irradiated through the non-patternportion; etching the substrate by using the resin layer having theimprint pattern as a mask; and removing the resin layer remaining on thesubstrate after the etching.
 10. The process according to claim 9,wherein an uncured resin material is removed before the etching.
 11. Aprocess for producing a structure, the process comprising: preparing animprint apparatus comprising: a mold comprising a processing side havingan imprint pattern, a back side opposite from the processing side, and anon-pattern portion at which the imprint pattern is not provided; and anexposure light source, wherein the mold further comprises alight-blocking member disposed at the non-pattern portion so as todecrease an amount of light with which the member to be processed isirradiated through the non-pattern portion; and curing a specificportion of photocurable resin material located in a processing area toeffect transfer of a pattern formed on a processing side of a mold.